Konnect MCP server (KiCad)ECADConfidence: Medium

Flipping a component with Konnect does not mirror inner copper layers the way KiCad does. On an 8-layer board the footprint moved sides but its pads stayed on In5.Cu instead of mirroring to In2.Cu, and 5 net-ties ended up tying LPDDR4 branch nets on the In5 GND plane layer instead of In2, with no warning.

Impact Analysis

Persona

Electrical Engineer

Team Size Impact

5x Multiplier

Prototype Delay

5 Days

Est. Annual Cost

$30,000

1 user · 1 month480 min
Rest of team1,920 min
Rest of year26,400 min

monthly_minutes × 12 × team_multiplier ÷ 60 × $75/hr = $30k/yr

$75/hr assumed rate.

Annual team-minutes decomposed from the reported monthly inputs.

Evidence & Sources

1 Sources

Konnect issue #831: flip_component and back-side library refresh don't mirror inner copper layers (In2<->In5 on 8 layers)

github.com

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Analyst Notes

From the Grok ProductFlo pain-radar compilation, finding 31, found 2026-10-10, score 5/5. Verbatim evidence: "On the affected board, 5 net-ties ended up tying LPDDR4 branch nets on the In5 GND plane layer instead of In2." Cost model assumes a board respin if the mis-layered pads reach fab, or hours of pad-by-pad rework if caught in review.